Exam Details
| Subject | Microelectronics Technology | |
| Paper | ||
| Exam / Course | Diploma In Electronics And Communication Engineering (DECVI)/ Advanced Level Certificate Course In Electronics And Communication Engineering (ACEVI)/ | |
| Department | School of Engineering & Technology (SOET) | |
| Organization | indira gandhi national open university | |
| Position | ||
| Exam Date | December, 2016 | |
| City, State | new delhi, |
Question Paper
No. of Printed Pages: 3 IQIELE-0021
B.Tech. -VIEP -ELECTRONICS AND
COMMUNICATION ENGINEERING (BTECVI)
Term-End
December, 2016
BIELE-002 MICROELECTRONICS TECHNOLOGY
Time: 3 hours Maximum Marks: 70
Note: Attempt any seven questions. All questions carry equal marks. Assume suitable missing data, if any. Use of scientific calculator is permitted.
1. With a neat sketch, explain Czochralski method of crystal growth in detail. 10
2. Explain vapour phase epitaxy for silicon. Also discuss impurity redistribution during growth. 10
3. Discuss the steps involved m CMOS-Inverter fabrication with suitable diagrams. 10
4. Why is plasma etching preferred in CMOS IC fabrication Compare five different types of plasma etching systems. 10
5. What is lithography.? Explain with diagrams, the steps involved in photolithography. 5
What is photoresist? Give its classification with some examples. 5
6. Explain the growth mechanism and kinetics of oxidation using Deal-Grove Model. 10
7. Explain the problems associated with silicon diffusion. 5
Explain the range theory of ion-implantation. 5
8. Draw the sketches illustrating a plane, a plane and a plane in a cubic unit cell. How many equivalent planes are there in a cubic crystal A material has a face centred cubic structure with an ionic radius of 1.06 A.Calculate the interplanar separation for planes. 10
9. Write short notes on any two of the following: 2 x 5=10 Interstitial Diffusion Oxide Isolation Dry and Wet Oxidation
10. What are the films used for interconnection in single metal, multi metal, and multi level metallization schemes? 3
Discuss the steps involved in integration of Bipolar process. 7
B.Tech. -VIEP -ELECTRONICS AND
COMMUNICATION ENGINEERING (BTECVI)
Term-End
December, 2016
BIELE-002 MICROELECTRONICS TECHNOLOGY
Time: 3 hours Maximum Marks: 70
Note: Attempt any seven questions. All questions carry equal marks. Assume suitable missing data, if any. Use of scientific calculator is permitted.
1. With a neat sketch, explain Czochralski method of crystal growth in detail. 10
2. Explain vapour phase epitaxy for silicon. Also discuss impurity redistribution during growth. 10
3. Discuss the steps involved m CMOS-Inverter fabrication with suitable diagrams. 10
4. Why is plasma etching preferred in CMOS IC fabrication Compare five different types of plasma etching systems. 10
5. What is lithography.? Explain with diagrams, the steps involved in photolithography. 5
What is photoresist? Give its classification with some examples. 5
6. Explain the growth mechanism and kinetics of oxidation using Deal-Grove Model. 10
7. Explain the problems associated with silicon diffusion. 5
Explain the range theory of ion-implantation. 5
8. Draw the sketches illustrating a plane, a plane and a plane in a cubic unit cell. How many equivalent planes are there in a cubic crystal A material has a face centred cubic structure with an ionic radius of 1.06 A.Calculate the interplanar separation for planes. 10
9. Write short notes on any two of the following: 2 x 5=10 Interstitial Diffusion Oxide Isolation Dry and Wet Oxidation
10. What are the films used for interconnection in single metal, multi metal, and multi level metallization schemes? 3
Discuss the steps involved in integration of Bipolar process. 7
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Subjects
- Advance Microprocessor And Architecture
- Analog And Mixed Mode Vlsi Design
- Analog Communication
- Analog Electronic Circuits
- Analog Integrated Circuits Design
- Antennas And Propagation
- Applied Electronics
- Audio and Video Engineering
- Basic Telematics
- Basics Of Electronics Engineering
- Bio Informatics
- Circuits and Networks
- Computer Architecture
- Computer Communication Networks
- Control Engineering
- Data Communication And Network
- Data Structures
- Device Modelling For Circuit Simulation
- Digital Communication
- Digital Electronics
- Digital Signal Processing
- Digital System Design
- Dip- ECE PCB Design & Testing
- Electromagnetic Field Theory
- Electronic Measurement And Instrumentations
- Electronic Measurement and Instruments
- Electronic Product Design
- Electronic Switching Circuits
- Embedded System Design
- Industrial Electronics
- Information Theory And Coding
- Linear Integrated Circuits
- Maintenance Of Electronic Equipment
- Micro Controller
- Micro Controllers
- Microelectronics Technology
- Microprocessor
- Microprocessor And Its Applications
- Microwave And Radar Engineering
- Modeling And Testing Of Digital Systems
- Multirate Systems
- Nano - Electronics
- Optical Fiber Communication
- Opto Electronics Communication Systems
- Power Electronics
- Principles of Communication Engineering
- Quantum Communication
- Rf Circuits
- Satellite And Tv Engineering
- Signal Compression
- Signals And Systems
- Technical English
- Television Engineering
- Wireless Communication