Exam Details
| Subject | Microelectronics Technology | |
| Paper | ||
| Exam / Course | Diploma In Electronics And Communication Engineering (DECVI)/ Advanced Level Certificate Course In Electronics And Communication Engineering (ACEVI)/ | |
| Department | School of Engineering & Technology (SOET) | |
| Organization | indira gandhi national open university | |
| Position | ||
| Exam Date | June, 2015 | |
| City, State | new delhi, |
Question Paper
Explain the Czochralski crystal growth process using suitable diagram.
A boron-doped crystal is measured at its seed end with a four-point probe of spacing 1 mm. The reading is 10 ohm. What is the seed end doping and the. expected reading at 0·95 fraction solidified [Solid Concentration x 10^15 atoms/cm^3, Ko =0·8]
Explain the process of silicon shaping.
Explain the basic transport processes and reaction kinetics of Vapour-phase epitaxy.
What is the difference between wet oxidation and dry oxidation?
Discuss the growth mechanism and kinetics of oxidation using Deal-Grove model.
4. Explain the process of Photo Lithography. Differentiate between Photo and Electron Lithography process.
Explain the Reactive Plasma Etching process. Describe the properties of plasma.
Discuss the wet etching process with required diagram.
Derive the diffusion equations for the diffusion process associated with constant surface concentration and constant total dopant.
Define diffusion process. What are the different steps of diffusion process
7. Describe the range theory of ion-implantation. What are the limitations associated with the ion-implantation system used in IC fabrication technology?
Discuss the process of physical vapour deposition used for metallization process.
What are the metallization problems associated with deposition, processing and electromigration?
Discuss the fabrication process sequence of twin-tub CMOS structure using suitable diagrams.
What are the fundamental considerations for IC processing?
10. Write short notes on any two of the following:
Float-Zone Process of Crystal Growth
Wet vs Dry Etching Comparison
Multi-level Metallization
A boron-doped crystal is measured at its seed end with a four-point probe of spacing 1 mm. The reading is 10 ohm. What is the seed end doping and the. expected reading at 0·95 fraction solidified [Solid Concentration x 10^15 atoms/cm^3, Ko =0·8]
Explain the process of silicon shaping.
Explain the basic transport processes and reaction kinetics of Vapour-phase epitaxy.
What is the difference between wet oxidation and dry oxidation?
Discuss the growth mechanism and kinetics of oxidation using Deal-Grove model.
4. Explain the process of Photo Lithography. Differentiate between Photo and Electron Lithography process.
Explain the Reactive Plasma Etching process. Describe the properties of plasma.
Discuss the wet etching process with required diagram.
Derive the diffusion equations for the diffusion process associated with constant surface concentration and constant total dopant.
Define diffusion process. What are the different steps of diffusion process
7. Describe the range theory of ion-implantation. What are the limitations associated with the ion-implantation system used in IC fabrication technology?
Discuss the process of physical vapour deposition used for metallization process.
What are the metallization problems associated with deposition, processing and electromigration?
Discuss the fabrication process sequence of twin-tub CMOS structure using suitable diagrams.
What are the fundamental considerations for IC processing?
10. Write short notes on any two of the following:
Float-Zone Process of Crystal Growth
Wet vs Dry Etching Comparison
Multi-level Metallization
Other Question Papers
Departments
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- Centre for Corporate Education, Training & Consultancy (CCETC)
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- School of Continuing Education (SOCE)
- School of Education (SOE)
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Subjects
- Advance Microprocessor And Architecture
- Analog And Mixed Mode Vlsi Design
- Analog Communication
- Analog Electronic Circuits
- Analog Integrated Circuits Design
- Antennas And Propagation
- Applied Electronics
- Audio and Video Engineering
- Basic Telematics
- Basics Of Electronics Engineering
- Bio Informatics
- Circuits and Networks
- Computer Architecture
- Computer Communication Networks
- Control Engineering
- Data Communication And Network
- Data Structures
- Device Modelling For Circuit Simulation
- Digital Communication
- Digital Electronics
- Digital Signal Processing
- Digital System Design
- Dip- ECE PCB Design & Testing
- Electromagnetic Field Theory
- Electronic Measurement And Instrumentations
- Electronic Measurement and Instruments
- Electronic Product Design
- Electronic Switching Circuits
- Embedded System Design
- Industrial Electronics
- Information Theory And Coding
- Linear Integrated Circuits
- Maintenance Of Electronic Equipment
- Micro Controller
- Micro Controllers
- Microelectronics Technology
- Microprocessor
- Microprocessor And Its Applications
- Microwave And Radar Engineering
- Modeling And Testing Of Digital Systems
- Multirate Systems
- Nano - Electronics
- Optical Fiber Communication
- Opto Electronics Communication Systems
- Power Electronics
- Principles of Communication Engineering
- Quantum Communication
- Rf Circuits
- Satellite And Tv Engineering
- Signal Compression
- Signals And Systems
- Technical English
- Television Engineering
- Wireless Communication