Exam Details
Subject | microsystem technology | |
Paper | ||
Exam / Course | m.sc.nano science and technology | |
Department | ||
Organization | alagappa university | |
Position | ||
Exam Date | April, 2016 | |
City, State | tamil nadu, karaikudi |
Question Paper
M.Sc. DEGREE EXAMINATION, APRIL 2016
Nano Science and Technology
MICROSYSTEM TECHNOLOGY
(CBCS 2013 onwards)
Time 3 Hours Maximum 75 Marks
Section A (10 2 20)
Answer all the questions.
1. What is the role of inert gas in physical vapour deposition
of thinfilms?
2. What are the factors influencing the formation of
thinfilms using PLD?
3. State the differences between dry etching and wet
etching.
4. Write anyone method for the preparation of SiO2 layer or
film for MEMS application.
5. What are dark and light field masks?
6. Why synchrotron radiation is used for lithography?
7. What are conductive polymers?
8. What are the important factors influencing the
performance of MEMS?
9. Write the applications of biomedical MEMS.
10. What are the applications of RF- MEMS?
Sub. Code
533503
RW-11019
2
Sp 1
Section B 5 25)
Answer any five questions.
11. Describe the crystal structure of GaAs and discuss
why it is used as substrate material for preparing
thinfilms.
Or
Explain the preparation of thin films by sputtering
technique, with neat diagram.
12. Explain the basic principle of micro-electrical
discharge machining process.
Or
Describe in detail the process of bulk micro
machining.
13. Describe in detail the fundamental steps involved in
lithographic process.
Or
Describe the process for making masks in advanced
lithographic techniques.
14. Explain in detail the working of pressure sensors
and their applications.
Or
Describe the performance evaluation of MEMS
accelerometers.
15. Explain in detail the process of micro-sterero
lithography.
Or
Discuss on Silicon carbide as a new MEMS
technology.
RW-11019
3
Sp 1
Section C 10 30)
Answer any three questions.
16. Discuss in detail the working principle, process and
instrumentation of MOCVD. Also write its applications.
17. Explain the most important process steps involved in
semiconductor fabrication.
18. Describe the process of X-ray lithography. Write its
advantages and applications.
19. Explain the procedural steps for silicon fusion bonding for
the fabrication of MEMS.
20. Discuss in detail the fabrication process and applications
of polymer based micro machining technologies.
Nano Science and Technology
MICROSYSTEM TECHNOLOGY
(CBCS 2013 onwards)
Time 3 Hours Maximum 75 Marks
Section A (10 2 20)
Answer all the questions.
1. What is the role of inert gas in physical vapour deposition
of thinfilms?
2. What are the factors influencing the formation of
thinfilms using PLD?
3. State the differences between dry etching and wet
etching.
4. Write anyone method for the preparation of SiO2 layer or
film for MEMS application.
5. What are dark and light field masks?
6. Why synchrotron radiation is used for lithography?
7. What are conductive polymers?
8. What are the important factors influencing the
performance of MEMS?
9. Write the applications of biomedical MEMS.
10. What are the applications of RF- MEMS?
Sub. Code
533503
RW-11019
2
Sp 1
Section B 5 25)
Answer any five questions.
11. Describe the crystal structure of GaAs and discuss
why it is used as substrate material for preparing
thinfilms.
Or
Explain the preparation of thin films by sputtering
technique, with neat diagram.
12. Explain the basic principle of micro-electrical
discharge machining process.
Or
Describe in detail the process of bulk micro
machining.
13. Describe in detail the fundamental steps involved in
lithographic process.
Or
Describe the process for making masks in advanced
lithographic techniques.
14. Explain in detail the working of pressure sensors
and their applications.
Or
Describe the performance evaluation of MEMS
accelerometers.
15. Explain in detail the process of micro-sterero
lithography.
Or
Discuss on Silicon carbide as a new MEMS
technology.
RW-11019
3
Sp 1
Section C 10 30)
Answer any three questions.
16. Discuss in detail the working principle, process and
instrumentation of MOCVD. Also write its applications.
17. Explain the most important process steps involved in
semiconductor fabrication.
18. Describe the process of X-ray lithography. Write its
advantages and applications.
19. Explain the procedural steps for silicon fusion bonding for
the fabrication of MEMS.
20. Discuss in detail the fabrication process and applications
of polymer based micro machining technologies.
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