M.Sc. DEGREE EXAMINATION, NOVEMBER 2017
Third Semester
Nano Science and Technology
MICROSYSTEM TECHNOLOGY
(CBCS 2016 onwards)
Time 3 Hours Maximum 75 Marks
Part A (10 x 2 20)
Answer all questions.
1. What are the applications of semiconducting thin films?
2. Explain the Chemical Vapor Deposition Method.
3. Give a brief note on silicon micro machining.
4. What is a Dry etching technology?
5. Discuss briefly about masking done in lithography.
6. Write a short note on e-beam lithography.
7. What do you mean by fusion bonding?
8. How polymer used in Microsystems?
9. What is the non-silicon materials used in MEMS
technology?
10. What is RF MEMS and Mention their applications.
Sub. Code
533503
RW-889
2
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Part B x 5 25)
Answer all questions choosing either or
11. Explain the principle and working of thin film
sensors.
Or
Write a short note on sol-gel method.
12. Explain in detail the various Microsystems
fabrication techniques.
Or
Discuss in general about the silicon fabrication
process.
13. Explain the importance and working of synchrotron
radiation lithography.
Or
Discuss about the design and patterning using
photolithography.
14. Discuss in detail about the role of pressure sensors
in Microsystems.
Or
What are the methodologies used to evaluating the
MEMS performance?
15. Discuss in detail about micro-stereolithography
technique.
Or
What is integration of Microsystems? Give example.
RW-889
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Part C x 10 30)
Answer any three questions.
16. Discuss in detail about the different Physical methods
used for the deposition of thin films.
17. Discuss the dry etching techniques used for metals,
insulators and semiconductors. Explain in detail with
suitable examples.
18. Describe in details the principle and processing of
advanced lithography.
19. Give a detailed note on packaging of MEMS devices and
explain MEMS performance and evaluation.
20. Explain the non-silicon MEMS and related fabrication
techniques detail.
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