Exam Details

Subject design for manufacturing mems and micro systems
Paper
Exam / Course m.tech
Department
Organization Institute Of Aeronautical Engineering
Position
Exam Date July, 2018
City, State telangana, hyderabad


Question Paper

Hall Ticket No Question Paper Code: BCC210
INSTITUTE OF AERONAUTICAL ENGINEERING
(Autonomous)
M.Tech II Semester End Examinations(Regular) July, 2018
Regulation: IARE R16
Design for Manufacturing MEMS and Micro Systems
Time: 3 Hours (CAD/CAM) Max Marks: 70
Answer ONE Question from each Unit
All Questions Carry Equal Marks
All parts of the question must be answered in one place only
UNIT I
1. Provide an account of evolution of micro fabrication and miniturization of MEMS.
List out the applications of MEMS in automobile industries.
2. Discuss the working principle of micro accelerometers.
Why are electrostatic forces used to run micro motors rather than conventional electromagnetic
forces? Explain why this actuation technique is not used in macrodevices and machines.

UNIT II
3. Explain the role of electrochemistry in micro fabrication highlighting advantages and disadvantages.

Discuss why atomic structure of matter is considered as a decisive factor in micro systems design.

4. Explain the plasma physics in detail and discuss how plasma generator works with a neat sketch.

The resistivity of the doped silicon at the depth of 6 is
cm. Calculate the time
required to dope born into the silicon substrate.
UNIT III
5. Explain the static bending theory applied to microsystems and deduce the equations.
Provide a detailed notes on the application of finite element stores analysis in microsystems
design.

6. Summarize the applications of FEM in the field of MEMS.
The vibration of the mass is initiated by a small "pull" downwards by an amount st =10 m.
The balanced mass spring system with spring constants K1=K2. Find the values of amplitude
and frequency of 10-mg mass suspended from a spring with a spring constant 7 x N/m.

Page 1 of 2
UNIT IV
7. Summarize the steps involved in design of a silicon die for pressure design for microsystem design
with a neat sketch.
Explain the phenomenon of incompressible fluid flow in micro conducts.
8. Discuss the heat conduction process in multilayered thin films
List out and discuss the design considerations of micro pressure sensor.
UNIT V
9. With the help of a suitable sketch discuss the process of ion implantation.
Differentiate ranging from bulk micro manufacturing and surface micromachining.
10. What are the different materials used in MEMS fabrication process and explain each one with
their properties and applications.
Write short notes on LIGA process and silicon piezoresistors.


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